Thursday, May 3, 2012

Read full story Invensas Targets Ultrabooks and Tablet Applications with DIMM-IN-A-PACKAGE Solution Based on xFD Technology Invensas Targets Ultrabooks and Tablet Applications

Invensas Corporation today introduced its DIMM-IN-A-PACKAGE multi-die face-down (xFD)TM technology for thin and light notebooks, also known as UltrabooksTM, and tablet computers. Invensas' novel solution delivers the memory capacity and performance of a small outline dual in-line memory module (SODIMM) in a miniature, soldered-down, ball grid array (BGA) package.

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