CY8C20247-24LKXI chip reverse, chip decryption, chip crack, mcu code extraction, mcu crack, mcu reverse.
Features
■ QuietZone? Controller
Patented Capacitive Sigma Delta PLUS (CSD PLUS?)
sensing algorithm for robust performance
High Sensitivity (0.1 pF) and best-in-class SNR performance
to support:
Ideal for proximity solutions
Overlay thickness of 15 mm for glass and 5 mm plastic
Superior noise immunity performance against conducted and
radiated noise and ultra low radiated emissions
Reliable and robust touch performance in noisy environments
Standardized user modules for overcoming noise
■ Low power CapSense
block with SmartSense? auto-tuning
Supports a combination of up to 31 buttons or 6 sliders, proximity sensors
Low average power consumption - 28 ?A for each sensor at
runtime (wake from sleep and scan sensors every 125 ms)
SmartSense auto-tuning
Sets and maintains optimal sensor performance during
runtime
Eliminates system tuning during development and production
Compensates for variations in manufacturing process
■ Driven shield available on five GPIO pins
Max load of 100 pF at 3 MHz
Frequency range: 375 kHz to 3 MHz
Delivers best-in class water tolerant designs
Robust proximity sensing in the presence of metal objects
■ Powerful Harvard-architecture processor
M8C CPU with a maximum speed of 24 MHz
Operating range: 1.71 V to 5.5 V
Standby mode: 1.1 μA (typ)
Deep sleep: 0.1 μA (typ)
Temperature range: –40 °C to +85 °C
■ Flexible on-chip memory
8 KB flash, 1 KB SRAM
16 KB flash, 2 KB SRAM
32 KB flash, 2 KB SRAM
50,000 flash erase/write cycles
In-system programming capability
■ Four clock sources
Internal main oscillator (IMO): 6/12/24 MHz
Internal low-speed oscillator (ILO) at 32 kHz for watchdog
and sleep timers
RC crystal oscillator
Clock input
■ Programmable pin configurations
Up to 32 general-purpose I/Os (GPIOs)
Dual mode GPIO
High sink current of 25 mA for each GPIO. Total 120 mA
maximum sink current per chip
5 mA source current on port 0 and 1 and 1 mA on port 2,3
and 4
Configurable internal pull-up, high-Z, and open drain modes
Selectable, regulated digital I/O on port 1
Configurable input threshold on port 1
■ Versatile analog mux
Common internal analog bus
Simultaneous connection of I/O
High power supply rejection ratio (PSRR) comparator
Low-dropout voltage regulator for all analog resources
■ Additional system resources
I2C slave:
Selectable to 50 kHz, 100 kHz, or 400 kHz
Selectable clock stretch or forced Nack mode
Implementation during sleep modes with less than 100 μA
I2C wake from sleep with hardware address validation
12 MHz SPI master and slave
Three 16-bit timers
Watchdog and sleep timers
Internal voltage reference
Integrated supervisory circuit
10-bit incremental analog-to-digital converter (ADC)
Two general-purpose high speed, low power analog comparators
■ Complete development tools
Free development tool (PSoC Designer?)
■ Package options
16-pin SOIC (150 mil)
16-pin QFN – 3 × 3 × 0.6 mm
24-pin QFN – 4 × 4 × 0.6 mm
32-pin QFN – 5 × 5 × 0.6 mm
48-pin QFN – 6 × 6 × 0.6 mm
30-ball WLCSP
Tuesday, October 30, 2012
CY8C20246AS-24LKXI chip reverse
CY8C20246AS-24LKXI chip reverse, chip decryption, chip crack, mcu code extraction, mcu crack, mcu reverse.
PSoC Designer? is the revolutionary integrated design
environment (IDE) that you can use to customize PSoC to meet
your specific application requirements. PSoC Designer software
accelerates system design and time to market. Develop your
applications using a library of precharacterized analog and digital
peripherals (called user modules) in a drag-and-drop design
environment. Then, customize your design by leveraging the
dynamically generated application programming interface (API)
libraries of code. Finally, debug and test your designs with the
integrated debug environment, including in-circuit emulation and
standard software debug features. PSoC Designer includes:
■ Application editor graphical user interface (GUI) for device and
user module configuration and dynamic reconfiguration
■ Extensive user module catalog
■ Integrated source-code editor (C and assembly)
■ Free C compiler with no size restrictions or time limits
■ Built-in debugger
■ In-circuit emulation
■ Built-in support for communication interfaces:
Hardware and software I2C slaves and masters
Full-speed USB 2.0
Up to four full-duplex universal asynchronous
receiver/transmitters (UARTs), SPI master and slave, and
wireless
PSoC Designer supports the entire library of PSoC 1 devices and
runs on Windows XP, Windows Vista, and Windows 7.
PSoC Designer? is the revolutionary integrated design
environment (IDE) that you can use to customize PSoC to meet
your specific application requirements. PSoC Designer software
accelerates system design and time to market. Develop your
applications using a library of precharacterized analog and digital
peripherals (called user modules) in a drag-and-drop design
environment. Then, customize your design by leveraging the
dynamically generated application programming interface (API)
libraries of code. Finally, debug and test your designs with the
integrated debug environment, including in-circuit emulation and
standard software debug features. PSoC Designer includes:
■ Application editor graphical user interface (GUI) for device and
user module configuration and dynamic reconfiguration
■ Extensive user module catalog
■ Integrated source-code editor (C and assembly)
■ Free C compiler with no size restrictions or time limits
■ Built-in debugger
■ In-circuit emulation
■ Built-in support for communication interfaces:
Hardware and software I2C slaves and masters
Full-speed USB 2.0
Up to four full-duplex universal asynchronous
receiver/transmitters (UARTs), SPI master and slave, and
wireless
PSoC Designer supports the entire library of PSoC 1 devices and
runs on Windows XP, Windows Vista, and Windows 7.
CY8C20246A-24LKXIT chip reverse
CY8C20246A-24LKXIT chip reverse, chip decryption, chip crack, mcu code extraction, mcu crack, mcu reverse.
The PSoC family consists of on-chip controller devices, which
are designed to replace multiple traditional microcontroller unit
(MCU)-based components with one, low cost single-chip
programmable component. A PSoC device includes
configurable analog and digital blocks, and programmable
interconnect. This architecture allows the user to create
customized peripheral configurations, to match the requirements
of each individual application. Additionally, a fast CPU, Flash
program memory, SRAM data memory, and configurable I/O are
included in a range of convenient pinouts.
The architecture for this device family, as shown in the Logic
Block Diagram on page 2, consists of three main areas:
■ The Core
■ CapSense Analog System
■ System Resources (including a full-speed USB port).
A common, versatile bus allows connection between I/O and the
analog system.
Each CY8C20X36A/46A/66A/96A/46AS/66AS PSoC device
includes a dedicated CapSense block that provides sensing and
scanning control circuitry for capacitive sensing applications.
Depending on the PSoC package, up to 36 GPIO are also
included. The GPIO provides access to the MCU and analog
mux.
The PSoC family consists of on-chip controller devices, which
are designed to replace multiple traditional microcontroller unit
(MCU)-based components with one, low cost single-chip
programmable component. A PSoC device includes
configurable analog and digital blocks, and programmable
interconnect. This architecture allows the user to create
customized peripheral configurations, to match the requirements
of each individual application. Additionally, a fast CPU, Flash
program memory, SRAM data memory, and configurable I/O are
included in a range of convenient pinouts.
The architecture for this device family, as shown in the Logic
Block Diagram on page 2, consists of three main areas:
■ The Core
■ CapSense Analog System
■ System Resources (including a full-speed USB port).
A common, versatile bus allows connection between I/O and the
analog system.
Each CY8C20X36A/46A/66A/96A/46AS/66AS PSoC device
includes a dedicated CapSense block that provides sensing and
scanning control circuitry for capacitive sensing applications.
Depending on the PSoC package, up to 36 GPIO are also
included. The GPIO provides access to the MCU and analog
mux.
CY8C20246A chip reverse
CY8C20246A chip reverse, chip decryption, chip crack, mcu code extraction, mcu crack, mcu reverse.
Features
■ Wide operating range: 1.71 V to 5.5 V
■ Ultra low deep sleep current: 100 nA
Configurable capacitive sensing elements
7 μA per sensor at 500 ms scan rate
Supports SmartSense Auto-tuning
Supports a combination of CapSense buttons, sliders,
touchpads, touchscreens, and proximity sensors
SmartSense_EMC offers superior noise immunity for
applications with challenging conducted and radiated noise
conditions
■ Powerful Harvard-architecture processor
M8C CPU – Up to 4 MIPS with 24 MHz Internal clock, external
crystal resonator or clock signal
Low power at high speed
■ Temperature range: –40 °C to +85 °C
■ Flexible on-chip memory
Three program/data storage size options:
8 KB flash/1 KB SRAM
16 KB flash/2 KB SRAM
32 KB flash/2 KB SRAM
50,000 flash erase/write cycles
Partial flash updates
Flexible protection modes
In-system serial programming (ISSP)
■ Full-speed USB
12 Mbps USB 2.0 compliant
■ Precision, programmable clocking
Internal main oscillator (IMO): 6/12/24 MHz ± 5%
Internal low speed oscillator (ILO) at 32 kHz for watchdog
and sleep timers
Precision 32 kHz oscillator for optional external crystal
■ Programmable pin configurations
Up to 36 general-purpose I/Os (GPIOs) (depending on
package)
Dual mode GPIO: All GPIOs support digital I/O and analog
inputs
25-mA sink current on each GPIO
120 mA total sink current on all GPIOs
Pull-up, high Z, open-drain modes on all GPIOs
CMOS drive mode –5 mA source current on ports 0 and 1
and 1 mA on ports 2, 3, and 4
20 mA total source current on all GPIOs
■ Versatile analog system
Low-dropout voltage regulator for all analog resources
Common internal analog bus enabling capacitive sensing on
all pins
High power supply rejection ratio (PSRR) comparator
8 to 10-bit incremental analog-to-digital converter (ADC)
■ Additional system resources
I2C slave:
Selectable to 50 kHz, 100 kHz, or 400 kHz
SPI master and slave: Configurable 46.9 kHz to 12 MHz
Three 16-bit timers
Watchdog and sleep timers
Integrated supervisory circuit
Emulated E2PROM using flash memory
■ Complete development tools
Free development tool (PSoC Designer?)
Full-featured, in-circuit emulator (ICE) and programmer
Full-speed emulation
Complex breakpoint structure
128 KB trace memory
■ Versatile package options
16-pin 3 × 3 × 0.6 mm QFN
24-pin 4 × 4 × 0.6 mm QFN
32-pin 5 × 5 × 0.6 mm QFN
48-pin SSOP
48-pin 7 × 7 × 1.0 mm QFN
30-ball WLCSP
Features
■ Wide operating range: 1.71 V to 5.5 V
■ Ultra low deep sleep current: 100 nA
Configurable capacitive sensing elements
7 μA per sensor at 500 ms scan rate
Supports SmartSense Auto-tuning
Supports a combination of CapSense buttons, sliders,
touchpads, touchscreens, and proximity sensors
SmartSense_EMC offers superior noise immunity for
applications with challenging conducted and radiated noise
conditions
■ Powerful Harvard-architecture processor
M8C CPU – Up to 4 MIPS with 24 MHz Internal clock, external
crystal resonator or clock signal
Low power at high speed
■ Temperature range: –40 °C to +85 °C
■ Flexible on-chip memory
Three program/data storage size options:
8 KB flash/1 KB SRAM
16 KB flash/2 KB SRAM
32 KB flash/2 KB SRAM
50,000 flash erase/write cycles
Partial flash updates
Flexible protection modes
In-system serial programming (ISSP)
■ Full-speed USB
12 Mbps USB 2.0 compliant
■ Precision, programmable clocking
Internal main oscillator (IMO): 6/12/24 MHz ± 5%
Internal low speed oscillator (ILO) at 32 kHz for watchdog
and sleep timers
Precision 32 kHz oscillator for optional external crystal
■ Programmable pin configurations
Up to 36 general-purpose I/Os (GPIOs) (depending on
package)
Dual mode GPIO: All GPIOs support digital I/O and analog
inputs
25-mA sink current on each GPIO
120 mA total sink current on all GPIOs
Pull-up, high Z, open-drain modes on all GPIOs
CMOS drive mode –5 mA source current on ports 0 and 1
and 1 mA on ports 2, 3, and 4
20 mA total source current on all GPIOs
■ Versatile analog system
Low-dropout voltage regulator for all analog resources
Common internal analog bus enabling capacitive sensing on
all pins
High power supply rejection ratio (PSRR) comparator
8 to 10-bit incremental analog-to-digital converter (ADC)
■ Additional system resources
I2C slave:
Selectable to 50 kHz, 100 kHz, or 400 kHz
SPI master and slave: Configurable 46.9 kHz to 12 MHz
Three 16-bit timers
Watchdog and sleep timers
Integrated supervisory circuit
Emulated E2PROM using flash memory
■ Complete development tools
Free development tool (PSoC Designer?)
Full-featured, in-circuit emulator (ICE) and programmer
Full-speed emulation
Complex breakpoint structure
128 KB trace memory
■ Versatile package options
16-pin 3 × 3 × 0.6 mm QFN
24-pin 4 × 4 × 0.6 mm QFN
32-pin 5 × 5 × 0.6 mm QFN
48-pin SSOP
48-pin 7 × 7 × 1.0 mm QFN
30-ball WLCSP
Thursday, October 18, 2012
CY7C1011CV33-12AXI code extraction
CY7C1011CV33-12AXI code extraction, chip decryption, mcu crack,
dsp crack .
The CY7C1011CV33 is a high performance complementary
metal oxide semiconductor (CMOS) static RAM organized as
131,072 words by 16 bits. This device has an automatic power
down feature that significantly reduces power consumption when
deselected.
To write to the device, take CE and Write Enable (WE) inputs
LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins
(I/O0
through I/O7
), is written into the location specified on the
address pins (A0
through A16
). If Byte High Enable (BHE) is
LOW, then data from I/O pins (I/O8
through I/O15
) is written into
the location specified on the address pins (A0
through A16
).
To read from the device, take CE and OE LOW while forcing the
Write Enable (WE) HIGH. If BLE is LOW, then data from the
memory location specified by the address pins appear on I/O0
to
I/O7
. If Byte High Enable (BHE) is LOW, then data from memory
appears on I/O8
to I/O15
. For more information, see the Truth
Table on page 10 for a complete description of Read and Write
modes.
The input and output pins (I/O0
through I/O15
) are placed in a
high impedance state when the device is deselected (CE HIGH),
the outputs are disabled (OE HIGH), the BHE and BLE are
disabled (BHE, BLE HIGH), or during a write operation (CE LOW
and WE LOW).
dsp crack .
The CY7C1011CV33 is a high performance complementary
metal oxide semiconductor (CMOS) static RAM organized as
131,072 words by 16 bits. This device has an automatic power
down feature that significantly reduces power consumption when
deselected.
To write to the device, take CE and Write Enable (WE) inputs
LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins
(I/O0
through I/O7
), is written into the location specified on the
address pins (A0
through A16
). If Byte High Enable (BHE) is
LOW, then data from I/O pins (I/O8
through I/O15
) is written into
the location specified on the address pins (A0
through A16
).
To read from the device, take CE and OE LOW while forcing the
Write Enable (WE) HIGH. If BLE is LOW, then data from the
memory location specified by the address pins appear on I/O0
to
I/O7
. If Byte High Enable (BHE) is LOW, then data from memory
appears on I/O8
to I/O15
. For more information, see the Truth
Table on page 10 for a complete description of Read and Write
modes.
The input and output pins (I/O0
through I/O15
) are placed in a
high impedance state when the device is deselected (CE HIGH),
the outputs are disabled (OE HIGH), the BHE and BLE are
disabled (BHE, BLE HIGH), or during a write operation (CE LOW
and WE LOW).
CY7C1011CV33-12ZSXE code extraction
CY7C1011CV33-12ZSXE code extraction, chip decryption, mcu crack, dsp crack .
Features
Temperature ranges
Industrial: –40 °C to 85 °C
Automotive-A: –40 °C to 85 °C
Automotive-E: –40 °C to 125 °C
Pin and function compatible with CY7C1011BV33
High speed
tAA = 10 ns (Industrial and Automotive-A)
tAA = 12 ns (Automotive-E)
Low active power
360 mW (max) (Industrial and Automotive-A)
2.0 V data retention
Automatic power down when deselected
Independent control of upper and lower bits
Easy memory expansion with Chip Enable (CE) and Output
Enable (OE) features
Available in Pb-free 44-pin thin small outline package
(TSOP) II, 44-pin thin quad flat package (TQFP), and non
Pb-free 48-ball very fine-pitch ball grid array (VFBGA)
packages
Features
Temperature ranges
Industrial: –40 °C to 85 °C
Automotive-A: –40 °C to 85 °C
Automotive-E: –40 °C to 125 °C
Pin and function compatible with CY7C1011BV33
High speed
tAA = 10 ns (Industrial and Automotive-A)
tAA = 12 ns (Automotive-E)
Low active power
360 mW (max) (Industrial and Automotive-A)
2.0 V data retention
Automatic power down when deselected
Independent control of upper and lower bits
Easy memory expansion with Chip Enable (CE) and Output
Enable (OE) features
Available in Pb-free 44-pin thin small outline package
(TSOP) II, 44-pin thin quad flat package (TQFP), and non
Pb-free 48-ball very fine-pitch ball grid array (VFBGA)
packages
CY7C1011DV33-10ZSXIT code extraction
CY7C1011DV33-10ZSXIT code extraction, chip decryption, mcu crack, dsp crack .
Functional Description
The CY7C1011DV33
[1]
is a high-performance CMOS Static
RAM organized as 128 K words by 16 bits.
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O0
through I/O7
), is
written into the location specified on the address pins (A0
through A16
). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O8
through I/O15
) is written into the location
specified on the address pins (A0
through A16
).
Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O0
to I/O7
. If Byte High Enable (BHE) is
LOW, then data from memory will appear on I/O8
to I/O15
. See
the truth table at the back of this data sheet for a complete
description of read and write modes.
The input/output pins (I/O0
through I/O15
) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE
are disabled (BHE, BLE HIGH), or during a write operation (CE
LOW, and WE LOW).
The CY7C1011DV33 is available in standard Pb-free 44-pin
TSOP II with center power and ground pinout, as well as
48-ball very fine-pitch ball grid array (VFBGA) packages.
Functional Description
The CY7C1011DV33
[1]
is a high-performance CMOS Static
RAM organized as 128 K words by 16 bits.
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O0
through I/O7
), is
written into the location specified on the address pins (A0
through A16
). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O8
through I/O15
) is written into the location
specified on the address pins (A0
through A16
).
Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O0
to I/O7
. If Byte High Enable (BHE) is
LOW, then data from memory will appear on I/O8
to I/O15
. See
the truth table at the back of this data sheet for a complete
description of read and write modes.
The input/output pins (I/O0
through I/O15
) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE
are disabled (BHE, BLE HIGH), or during a write operation (CE
LOW, and WE LOW).
The CY7C1011DV33 is available in standard Pb-free 44-pin
TSOP II with center power and ground pinout, as well as
48-ball very fine-pitch ball grid array (VFBGA) packages.
CY7C1012AV33-8BGCT code extraction
CY7C1012AV33-8BGCT code extraction, chip decryption, mcu crack, dsp crack .
Features
High speed
tAA = 8 ns
Low active power
1080 mW (max)
Operating voltages of 3.3 ± 0.3 V
2.0 V data retention
Automatic power-down when deselected
TTL-compatible inputs and outputs
Easy memory expansion with CE0
, CE1
and CE2
features
Available in non Pb-free 119 ball PBGA
CY7C1018DV33-10VXIT code extraction
CY7C1018DV33-10VXIT code extraction, chip decryption, mcu crack, dsp crack .
Features
Pin- and function-compatible with CY7C1018CV33
High speed
tAA = 10 ns
Low Active Power
ICC = 60 mA @ 10 ns
Low CMOS Standby Power
ISB2
= 3 mA
2.0V Data retention
Automatic power-down when deselected
CMOS for optimum speed/power
Center power/ground pinout
Easy memory expansion with CE and OE options
Available in Pb-free 32-pin 300-Mil wide Molded SOJ
Features
Pin- and function-compatible with CY7C1018CV33
High speed
tAA = 10 ns
Low Active Power
ICC = 60 mA @ 10 ns
Low CMOS Standby Power
ISB2
= 3 mA
2.0V Data retention
Automatic power-down when deselected
CMOS for optimum speed/power
Center power/ground pinout
Easy memory expansion with CE and OE options
Available in Pb-free 32-pin 300-Mil wide Molded SOJ
CY7C1019CV33-10ZXAT code extraction
CY7C1019CV33-10ZXAT code extraction, chip decryption, mcu crack, dsp crack .
The CY7C1019CV33 is a high performance CMOS static RAM
organized as 131,072 words by 8 bits. Easy memory expansion
is provided by an active LOW Chip Enable (CE), an active LOW
Output Enable (OE), and tristate drivers. This device has an
automatic power down feature that significantly reduces power
consumption when deselected.
Writing to the device is accomplished by taking Chip Enable (CE)
and Write Enable (WE) inputs LOW. Data on the eight I/O pins
(I/O0
through I/O7
) is then written into the location specified on
the address pins (A0
through A16
).
Reading from the device is accomplished by taking Chip Enable
(CE) and Output Enable (OE) LOW while forcing Write Enable
(WE) HIGH. Under these conditions, the contents of the memory
location specified by the address pins will appear on the I/O pins.
The eight input/output pins (I/O0
through I/O7
) are placed in a
high impedance state when the device is deselected (CE HIGH),
the outputs are disabled (OE HIGH), or during a write operation
(CE LOW, and WE LOW).
The CY7C1019CV33 is a high performance CMOS static RAM
organized as 131,072 words by 8 bits. Easy memory expansion
is provided by an active LOW Chip Enable (CE), an active LOW
Output Enable (OE), and tristate drivers. This device has an
automatic power down feature that significantly reduces power
consumption when deselected.
Writing to the device is accomplished by taking Chip Enable (CE)
and Write Enable (WE) inputs LOW. Data on the eight I/O pins
(I/O0
through I/O7
) is then written into the location specified on
the address pins (A0
through A16
).
Reading from the device is accomplished by taking Chip Enable
(CE) and Output Enable (OE) LOW while forcing Write Enable
(WE) HIGH. Under these conditions, the contents of the memory
location specified by the address pins will appear on the I/O pins.
The eight input/output pins (I/O0
through I/O7
) are placed in a
high impedance state when the device is deselected (CE HIGH),
the outputs are disabled (OE HIGH), or during a write operation
(CE LOW, and WE LOW).
Tuesday, October 16, 2012
CY7C027-20AXCT MCU Code Reading
CY7C027-20AXCT MCU Code Reading, Programm Reading, MCU Crack,
Chip Decryption.
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
Chip Decryption.
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
CY7C027-20AXCT MCU Code Reading
CY7C027-20AXCT MCU Code Reading, Programm Reading, MCU Crack,
Chip Decryption.
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
Chip Decryption.
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
CY7C028-15AXI MCU Code Reading
CY7C028-15AXI MCU Code Reading, Programm Reading, MCU Crack,
Chip Decryption.
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
Chip Decryption.
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
CY7C028-15AXC MCU Code Reading
CY7C028-15AXC MCU Code Reading, Programm Reading, MCU Crack,
Chip Decryption.
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
Chip Decryption.
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
CY7C037AV-20AXC MCU Code Reading
CY7C037AV-20AXC MCU Code Reading, Programm Reading, MCU Crack,
Chip Decryption.
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
Chip Decryption.
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
CY7C028-15AI MCU Code Reading
CY7C028-15AI MCU Code Reading, Programm Reading, MCU Crack,
Chip Decryption.
Features
True dual-ported memory cells which allow
simultaneous access of the same memory location
32K x 16 organization (CY7C027V/027AV
64K x 16 organization (CY7C028V)
32K x 18 organization (CY7C037AV)
64K x 18 organization (CY7C038V)
0.35 micron Complementary metal oxide semiconductor
(CMOS) for optimum speed and power
High speed access: 15, 20, and 25 ns
Low operating power
Active: ICC = 115 mA (typical)
Standby: ISB3
= 10 A (typical)
Fully asynchronous operation
Automatic power-down
Expandable data bus to 32/36 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flag for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and Industrial temperature ranges
100-pin Pb-free Thin quad plastic flatpack (TQFP) and 100-pin
TQFP
Chip Decryption.
Features
True dual-ported memory cells which allow
simultaneous access of the same memory location
32K x 16 organization (CY7C027V/027AV
64K x 16 organization (CY7C028V)
32K x 18 organization (CY7C037AV)
64K x 18 organization (CY7C038V)
0.35 micron Complementary metal oxide semiconductor
(CMOS) for optimum speed and power
High speed access: 15, 20, and 25 ns
Low operating power
Active: ICC = 115 mA (typical)
Standby: ISB3
= 10 A (typical)
Fully asynchronous operation
Automatic power-down
Expandable data bus to 32/36 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flag for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and Industrial temperature ranges
100-pin Pb-free Thin quad plastic flatpack (TQFP) and 100-pin
TQFP
Monday, September 17, 2012
handler index
Motion
Throughput Up to 1400 UPH (units per hour) handler index time with zero programming time for SuperBOT-I
Content High performance control card & servo drive system.
Resolution X axis: (+/-)0.02mm; Y axis:(+/-) 0.02mm; Z axis: (+/-)0.05mm.
Max. stroke X axis: 500 mm; Y axis: 380mm; Z axis:60mm.
Pick & Place head placement accuracy (+/-) 0.08mm.
Vision System
Camera 400*400 pixels.
Vision resolution 0.1mm.
Process time per view ~0.5sec.
I/O Devices
Tray : It is the standard I/O device of the machine. Users provide the type and three special positions of the tray, and the system can calculate the position of each chip on the tray.
Auto tray : This device includes tray in and tray out. Users can put 10 trays into the device. When the machine is running, users can add trays or take out trays without stopping the machine.
Tape-in Device : An input device for tapes with IC packaging. It must be modified for custom IC size.
Tape-out Device : An output device for tapes with IC packaging. It handles tape widths of 12mm to 40mm. The tape can be air-pressed or heat-sealed.
Tube-In Device
Tube-Out Device
Assistant Control
Built-in Control : PC-based control with Windows XP.
Display : LCD monitor.
Data entry : Keyboard & mouse.
Throughput Up to 1400 UPH (units per hour) handler index time with zero programming time for SuperBOT-I
Content High performance control card & servo drive system.
Resolution X axis: (+/-)0.02mm; Y axis:(+/-) 0.02mm; Z axis: (+/-)0.05mm.
Max. stroke X axis: 500 mm; Y axis: 380mm; Z axis:60mm.
Pick & Place head placement accuracy (+/-) 0.08mm.
Vision System
Camera 400*400 pixels.
Vision resolution 0.1mm.
Process time per view ~0.5sec.
I/O Devices
Tray : It is the standard I/O device of the machine. Users provide the type and three special positions of the tray, and the system can calculate the position of each chip on the tray.
Auto tray : This device includes tray in and tray out. Users can put 10 trays into the device. When the machine is running, users can add trays or take out trays without stopping the machine.
Tape-in Device : An input device for tapes with IC packaging. It must be modified for custom IC size.
Tape-out Device : An output device for tapes with IC packaging. It handles tape widths of 12mm to 40mm. The tape can be air-pressed or heat-sealed.
Tube-In Device
Tube-Out Device
Assistant Control
Built-in Control : PC-based control with Windows XP.
Display : LCD monitor.
Data entry : Keyboard & mouse.
Built-in Programmer
Built-in Programmer
Programming systems are USB Interfaced 4 Ultra-high Speed Stand-alone Universal Device Programming units; SuperPro 5000
Hardware & electrical Specifications
Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU, Standard Logic.
Packages supported: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP
PC interface: USB2.0
Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output -; power:2KW
Mechanical parameter: Main unit: Size: 820*640*1550 mm Weight: 547 lbs (248 Kg.)=
Packing weight: 594 lbs (270 Kg.)
I/O Devices
I/O Devices
Tray : It is the standard I/O device of the machine. Users provide the type and three special positions of the tray, and the system can calculate the position of each chip on the tray.
Auto tray : This device includes tray in and tray out. Users can put 10 trays into the device. When the machine is running, users can add trays or take out trays without stopping the machine.
Tape-in Device : An input device for tapes with IC packaging. It must be modified for custom IC size.
Tape-out Device : An output device for tapes with IC packaging. It handles tape widths of 12mm to 40mm. The tape can be air-pressed or heat-sealed.
Tube-In Device
Tube-Out Device
Assistant Control
Built-in Control : PC-based control with Windows XP.
Display : LCD monitor.
Data entry : Keyboard & mouse.
Built-in Programmer
Programming systems are USB Interfaced 4 Ultra-high Speed Stand-alone Universal Device Programming units; SuperPro 5000
Hardware & electrical Specifications
Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU, Standard Logic.
Packages supported: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP
PC interface: USB2.0
Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output -; power:2KW
Mechanical parameter: Main unit: Size: 820*640*1550 mm Weight: 547 lbs (248 Kg.)=
Packing weight: 594 lbs (270 Kg.)
Tray : It is the standard I/O device of the machine. Users provide the type and three special positions of the tray, and the system can calculate the position of each chip on the tray.
Auto tray : This device includes tray in and tray out. Users can put 10 trays into the device. When the machine is running, users can add trays or take out trays without stopping the machine.
Tape-in Device : An input device for tapes with IC packaging. It must be modified for custom IC size.
Tape-out Device : An output device for tapes with IC packaging. It handles tape widths of 12mm to 40mm. The tape can be air-pressed or heat-sealed.
Tube-In Device
Tube-Out Device
Assistant Control
Built-in Control : PC-based control with Windows XP.
Display : LCD monitor.
Data entry : Keyboard & mouse.
Built-in Programmer
Programming systems are USB Interfaced 4 Ultra-high Speed Stand-alone Universal Device Programming units; SuperPro 5000
Hardware & electrical Specifications
Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU, Standard Logic.
Packages supported: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP
PC interface: USB2.0
Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output -; power:2KW
Mechanical parameter: Main unit: Size: 820*640*1550 mm Weight: 547 lbs (248 Kg.)=
Packing weight: 594 lbs (270 Kg.)
Built-in Programmer Xeltek SuperBOT-I Automated Handler
Built-in Programmer
Programming systems are USB Interfaced 4 Ultra-high Speed Stand-alone Universal Device Programming units; SuperPro 5000
Hardware & electrical Specifications
Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU, Standard Logic.
Packages supported: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP
PC interface: USB2.0
Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output -; power:2KW
Mechanical parameter: Main unit: Size: 820*640*1550 mm Weight: 547 lbs (248 Kg.)=
Packing weight: 594 lbs (270 Kg.)
Programming systems are USB Interfaced 4 Ultra-high Speed Stand-alone Universal Device Programming units; SuperPro 5000
Hardware & electrical Specifications
Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU, Standard Logic.
Packages supported: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP
PC interface: USB2.0
Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output -; power:2KW
Mechanical parameter: Main unit: Size: 820*640*1550 mm Weight: 547 lbs (248 Kg.)=
Packing weight: 594 lbs (270 Kg.)
Assistant Control Xeltek SuperBOT-I Automated Handler
Assistant Control
Built-in Control : PC-based control with Windows XP.
Display : LCD monitor.
Data entry : Keyboard & mouse.
Built-in Programmer
Programming systems are USB Interfaced 4 Ultra-high Speed Stand-alone Universal Device Programming units; SuperPro 5000
Vision System Xeltek SuperBOT-I Automated Handler
Vision System
Camera 400*400 pixels.
Vision resolution 0.1mm.
Process time per view ~0.5sec.
I/O Devices
Tray : It is the standard I/O device of the machine. Users provide the type and three special positions of the tray, and the system can calculate the position of each chip on the tray.
Auto tray : This device includes tray in and tray out. Users can put 10 trays into the device. When the machine is running, users can add trays or take out trays without stopping the machine.
Tape-in Device : An input device for tapes with IC packaging. It must be modified for custom IC size.
Tape-out Device : An output device for tapes with IC packaging. It handles tape widths of 12mm to 40mm. The tape can be air-pressed or heat-sealed.
Tube-In Device
Tube-Out Device
Camera 400*400 pixels.
Vision resolution 0.1mm.
Process time per view ~0.5sec.
I/O Devices
Tray : It is the standard I/O device of the machine. Users provide the type and three special positions of the tray, and the system can calculate the position of each chip on the tray.
Auto tray : This device includes tray in and tray out. Users can put 10 trays into the device. When the machine is running, users can add trays or take out trays without stopping the machine.
Tape-in Device : An input device for tapes with IC packaging. It must be modified for custom IC size.
Tape-out Device : An output device for tapes with IC packaging. It handles tape widths of 12mm to 40mm. The tape can be air-pressed or heat-sealed.
Tube-In Device
Tube-Out Device
Xeltek SuperBOT-I Automated Handler Motion
Motion
Throughput Up to 1400 UPH (units per hour) handler index time with zero programming time for SuperBOT-I
Content High performance control card & servo drive system.
Resolution X axis: (+/-)0.02mm; Y axis:(+/-) 0.02mm; Z axis: (+/-)0.05mm.
Max. stroke X axis: 500 mm; Y axis: 380mm; Z axis:60mm.
Pick & Place head placement accuracy (+/-) 0.08mm.
Expanded Features of Xeltek SuperBOT-I
Expanded Features
The largest device support in the industry: Supports over 72,120 IC devices from 264 manufacturers and continuing
Uses Industrial Personal Computer (with control card inside)
Carries servo system and vision system mode to locate fast and accurately and finish chip capture, placement, programming, and packaging automatically instead of traditional manual operation.
Internal programmers are 4 SuperPro 5000 modules, which are latest, high-speed and intelligent universal programmers from Xeltek. Each module can burn chips independently, so its efficiency is much higher than parallel-production programmers.
Its advantages includes:
Modularizing design of system
switching time
High throughput (1400 devices per hour)
Cost effective
IC packaging supports standard tray and Tape Reel, Tube input and output.
SuperBOT-I Automated Handler
Xeltek SuperBOT-I Automated Handler
SuperBOT-I is automated IC programming equipment; which is cost-effective, designed for manufacturing large-scale electronics. It does not only improve the production efficiency greatly, but also eliminates human errors during IC programming process. Device Transmission system uses high-speed and reliable design.
The performance of this equipment, both mechanical systems and programming system have reached the world's top level, yet the price of the equipment has been attracting many domestic firms' budgets, since it is highly cost-effective.
SuperBOT-I is automated IC programming equipment; which is cost-effective, designed for manufacturing large-scale electronics. It does not only improve the production efficiency greatly, but also eliminates human errors during IC programming process. Device Transmission system uses high-speed and reliable design.
The performance of this equipment, both mechanical systems and programming system have reached the world's top level, yet the price of the equipment has been attracting many domestic firms' budgets, since it is highly cost-effective.
Xeltek SuperBOT-I Automated Handler
Xeltek SuperBOT-I Automated Handler
SuperBOT-I is automated IC programming equipment; which is cost-effective, designed for manufacturing large-scale electronics. It does not only improve the production efficiency greatly, but also eliminates human errors during IC programming process. Device Transmission system uses high-speed and reliable design.
The performance of this equipment, both mechanical systems and programming system have reached the world's top level, yet the price of the equipment has been attracting many domestic firms' budgets, since it is highly cost-effective.
Expanded Features
The largest device support in the industry: Supports over 72,120 IC devices from 264 manufacturers and continuing
Uses Industrial Personal Computer (with control card inside)
Carries servo system and vision system mode to locate fast and accurately and finish chip capture, placement, programming, and packaging automatically instead of traditional manual operation.
Internal programmers are 4 SuperPro 5000 modules, which are latest, high-speed and intelligent universal programmers from Xeltek. Each module can burn chips independently, so its efficiency is much higher than parallel-production programmers.
Its advantages includes:
Modularizing design of system
switching time
High throughput (1400 devices per hour)
Cost effective
IC packaging supports standard tray and Tape Reel, Tube input and output.
Motion
Throughput Up to 1400 UPH (units per hour) handler index time with zero programming time for SuperBOT-I
Content High performance control card & servo drive system.
Resolution X axis: (+/-)0.02mm; Y axis:(+/-) 0.02mm; Z axis: (+/-)0.05mm.
Max. stroke X axis: 500 mm; Y axis: 380mm; Z axis:60mm.
Pick & Place head placement accuracy (+/-) 0.08mm.
Vision System
Camera 400*400 pixels.
Vision resolution 0.1mm.
Process time per view ~0.5sec.
I/O Devices
Tray : It is the standard I/O device of the machine. Users provide the type and three special positions of the tray, and the system can calculate the position of each chip on the tray.
Auto tray : This device includes tray in and tray out. Users can put 10 trays into the device. When the machine is running, users can add trays or take out trays without stopping the machine.
Tape-in Device : An input device for tapes with IC packaging. It must be modified for custom IC size.
Tape-out Device : An output device for tapes with IC packaging. It handles tape widths of 12mm to 40mm. The tape can be air-pressed or heat-sealed.
Tube-In Device
Tube-Out Device
Assistant Control
Built-in Control : PC-based control with Windows XP.
Display : LCD monitor.
Data entry : Keyboard & mouse.
Built-in Programmer
Programming systems are USB Interfaced 4 Ultra-high Speed Stand-alone Universal Device Programming units; SuperPro 5000
Hardware & electrical Specifications
Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU, Standard Logic.
Packages supported: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP
PC interface: USB2.0
Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output -; power:2KW
Mechanical parameter: Main unit: Size: 820*640*1550 mm Weight: 547 lbs (248 Kg.)=
Packing weight: 594 lbs (270 Kg.)
SuperBOT-I is automated IC programming equipment; which is cost-effective, designed for manufacturing large-scale electronics. It does not only improve the production efficiency greatly, but also eliminates human errors during IC programming process. Device Transmission system uses high-speed and reliable design.
The performance of this equipment, both mechanical systems and programming system have reached the world's top level, yet the price of the equipment has been attracting many domestic firms' budgets, since it is highly cost-effective.
Expanded Features
The largest device support in the industry: Supports over 72,120 IC devices from 264 manufacturers and continuing
Uses Industrial Personal Computer (with control card inside)
Carries servo system and vision system mode to locate fast and accurately and finish chip capture, placement, programming, and packaging automatically instead of traditional manual operation.
Internal programmers are 4 SuperPro 5000 modules, which are latest, high-speed and intelligent universal programmers from Xeltek. Each module can burn chips independently, so its efficiency is much higher than parallel-production programmers.
Its advantages includes:
Modularizing design of system
switching time
High throughput (1400 devices per hour)
Cost effective
IC packaging supports standard tray and Tape Reel, Tube input and output.
Motion
Throughput Up to 1400 UPH (units per hour) handler index time with zero programming time for SuperBOT-I
Content High performance control card & servo drive system.
Resolution X axis: (+/-)0.02mm; Y axis:(+/-) 0.02mm; Z axis: (+/-)0.05mm.
Max. stroke X axis: 500 mm; Y axis: 380mm; Z axis:60mm.
Pick & Place head placement accuracy (+/-) 0.08mm.
Vision System
Camera 400*400 pixels.
Vision resolution 0.1mm.
Process time per view ~0.5sec.
I/O Devices
Tray : It is the standard I/O device of the machine. Users provide the type and three special positions of the tray, and the system can calculate the position of each chip on the tray.
Auto tray : This device includes tray in and tray out. Users can put 10 trays into the device. When the machine is running, users can add trays or take out trays without stopping the machine.
Tape-in Device : An input device for tapes with IC packaging. It must be modified for custom IC size.
Tape-out Device : An output device for tapes with IC packaging. It handles tape widths of 12mm to 40mm. The tape can be air-pressed or heat-sealed.
Tube-In Device
Tube-Out Device
Assistant Control
Built-in Control : PC-based control with Windows XP.
Display : LCD monitor.
Data entry : Keyboard & mouse.
Built-in Programmer
Programming systems are USB Interfaced 4 Ultra-high Speed Stand-alone Universal Device Programming units; SuperPro 5000
Hardware & electrical Specifications
Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU, Standard Logic.
Packages supported: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP
PC interface: USB2.0
Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output -; power:2KW
Mechanical parameter: Main unit: Size: 820*640*1550 mm Weight: 547 lbs (248 Kg.)=
Packing weight: 594 lbs (270 Kg.)
Friday, September 14, 2012
XELTEK SuperPro 500P Universal IC Chip Device Programmer
XELTEK SuperPro 500P Universal IC Chip Device Programmer
SKU SP500P
Weight 3.00 lbs
Number of Devices Supported 30,900+
Number of Manufacturers Supported 219
Number of Pins Available 48
Stand-Alone (PC-Free) No
Built-in Processor ARM7 RISC MCU
Free User Requested Device Update No
Windows Support Win XP/Vista/7 32/64 bit
RoHS & CE Compliance Yes
Warranty 2 Years
SKU SP500P
Weight 3.00 lbs
Number of Devices Supported 30,900+
Number of Manufacturers Supported 219
Number of Pins Available 48
Stand-Alone (PC-Free) No
Built-in Processor ARM7 RISC MCU
Free User Requested Device Update No
Windows Support Win XP/Vista/7 32/64 bit
RoHS & CE Compliance Yes
Warranty 2 Years
SuperPro 5004GP Universal Production
SuperPro 5004GP Universal Production/ Gang Device Programmer
SKU SP5004GP
Weight 24.00 lbs
Number of Devices Supported 83,100+
Number of Manufacturers Supported 297
Number of Pins Available 144
Stand-Alone (PC-Free) No
Socket Number 4
Clustering Ability No
Free User Requested Device Update Yes
Windows Support Win XP/Vista/7 32/64 bit
RoHS & CE Compliance Yes
Warranty 2 Years
SKU SP5004GP
Weight 24.00 lbs
Number of Devices Supported 83,100+
Number of Manufacturers Supported 297
Number of Pins Available 144
Stand-Alone (PC-Free) No
Socket Number 4
Clustering Ability No
Free User Requested Device Update Yes
Windows Support Win XP/Vista/7 32/64 bit
RoHS & CE Compliance Yes
Warranty 2 Years
Wednesday, September 12, 2012
LabTool-48UXP Programmer Device insertion and contact checks-- No mistakes!
LabTool-48UXP Programmer Device insertion and contact checks--
No mistakes!
The LabTool-48UXP performs device insertion and contact
checks before it programs each device. It can detect poor pin
contact and devices inserted upside down or in the wrong
position. This function protects your pocketbook by preventing
expensive chip damage due to operator error.
LabTool-48UXP Programmer EPROM and Flash memory ID detection
LabTool-48UXP Programmer EPROM and Flash memory ID detection and
Search
Many EPROM and Flash memories have a build-in device ID and
manufacturer ID. The LabTool-48UXP can read the device's ID by
press hot key to detect the ID and compare its database and
determined the chip's correct vendor and product number. This
feature is especially useful with secondhand chips and devices
that have had their part number accidentally (or intentionally)
removed (this function only applied to 28 pin or 32 pin EPROM
and Flash).
Search
Many EPROM and Flash memories have a build-in device ID and
manufacturer ID. The LabTool-48UXP can read the device's ID by
press hot key to detect the ID and compare its database and
determined the chip's correct vendor and product number. This
feature is especially useful with secondhand chips and devices
that have had their part number accidentally (or intentionally)
removed (this function only applied to 28 pin or 32 pin EPROM
and Flash).
Wednesday, September 5, 2012
AT32UC3A1512 MCU code extraction
AT32UC3A1512 MCU code extraction, atmel MCU reverse, atmel ic reverse,atmel PCB board cloning, atmel chip decryption .
NEW TEST -- The high-performance, low-power 32-bit AVR RISC-based microcontroller combines 512KB flash, 64KB SRAM, 10/100 ethernet MAC, full-speed (12 Mbps) USB 2.0 with embedded host capability, I2S, and a built-in audio D/A converter.
The MCU achieves 91 Dhrystone MIPS (DMIPS) at 66 MHz while consuming only 40 mA at 3.3V.
The Peripheral Direct Memory Access (PDCA) controller transfers data between peripherals and memories without processor involvement, drastically reducing processing with continuous large data streams within the MCU.
NEW TEST -- The high-performance, low-power 32-bit AVR RISC-based microcontroller combines 512KB flash, 64KB SRAM, 10/100 ethernet MAC, full-speed (12 Mbps) USB 2.0 with embedded host capability, I2S, and a built-in audio D/A converter.
The MCU achieves 91 Dhrystone MIPS (DMIPS) at 66 MHz while consuming only 40 mA at 3.3V.
The Peripheral Direct Memory Access (PDCA) controller transfers data between peripherals and memories without processor involvement, drastically reducing processing with continuous large data streams within the MCU.
AT32UC3A1256AU MCU code extraction
AT32UC3A1256AU MCU code extraction, atmel MCU reverse, atmel ic reverse,atmel PCB board cloning, atmel chip decryption .
The high-performance, low-power 32-bit AVR RISC-based microcontroller combines 256KB flash, 64KB SRAM, 10/100 ethernet MAC, full-speed (12 Mbps) USB 2.0 with embedded host capability, I2S, and a built-in audio D/A converter.
The MCU achieves 91 Dhrystone MIPS (DMIPS) at 66 MHz while consuming only 40 mA at 3.3V.
The Peripheral Direct Memory Access (PDCA) controller transfers data between peripherals and memories without processor involvement, drastically reducing processing with continuous large data streams within the MCU.
The AT32UC3A1256AU is the Audio version of the AT32UC3A1256. It allows the execution of Atmel licensed Audio firmware IPs.
One version is available:
AT32UC3A1256AU-AUR: TQFP100, industrial (-40°C to +85°C), reel conditioning.
The high-performance, low-power 32-bit AVR RISC-based microcontroller combines 256KB flash, 64KB SRAM, 10/100 ethernet MAC, full-speed (12 Mbps) USB 2.0 with embedded host capability, I2S, and a built-in audio D/A converter.
The MCU achieves 91 Dhrystone MIPS (DMIPS) at 66 MHz while consuming only 40 mA at 3.3V.
The Peripheral Direct Memory Access (PDCA) controller transfers data between peripherals and memories without processor involvement, drastically reducing processing with continuous large data streams within the MCU.
The AT32UC3A1256AU is the Audio version of the AT32UC3A1256. It allows the execution of Atmel licensed Audio firmware IPs.
One version is available:
AT32UC3A1256AU-AUR: TQFP100, industrial (-40°C to +85°C), reel conditioning.
AT32UC3A1256 MCU code extraction
AT32UC3A1256 MCU code extraction, atmel MCU reverse, atmel ic reverse,atmel PCB board cloning, atmel chip decryption .
The high-performance, low-power 32-bit AVR RISC-based microcontroller combines 256KB flash, 64KB SRAM, 10/100 ethernet MAC, full-speed (12 Mbps) USB 2.0 with embedded host capability, I2S, and a built-in audio D/A converter.
The MCU achieves 91 Dhrystone MIPS (DMIPS) at 66 MHz while consuming only 40 mA at 3.3V.
The Peripheral Direct Memory Access (PDCA) controller transfers data between peripherals and memories without processor involvement, drastically reducing processing with continuous large data streams within the MCU.
AT32UC3A1128 MCU code extraction
AT32UC3A1128 MCU code extraction, atmel MCU reverse, atmel ic reverse,atmel PCB board cloning, atmel chip decryption .
The high-performance, low-power 32-bit AVR RISC-based microcontroller combines 128KB flash, 32KB SRAM, 10/100 ethernet MAC, full-speed (12 Mbps) USB 2.0 with embedded host capability, I2S, and a built-in audio D/A converter.
The MCU achieves 91 Dhrystone MIPS (DMIPS) at 66 MHz while consuming only 40 mA at 3.3V.
The Peripheral Direct Memory Access (PDCA) controller transfers data between peripherals and memories without processor involvement, drastically reducing processing with continuous large data streams within the MCU.
The high-performance, low-power 32-bit AVR RISC-based microcontroller combines 128KB flash, 32KB SRAM, 10/100 ethernet MAC, full-speed (12 Mbps) USB 2.0 with embedded host capability, I2S, and a built-in audio D/A converter.
The MCU achieves 91 Dhrystone MIPS (DMIPS) at 66 MHz while consuming only 40 mA at 3.3V.
The Peripheral Direct Memory Access (PDCA) controller transfers data between peripherals and memories without processor involvement, drastically reducing processing with continuous large data streams within the MCU.
AT32UC3A0512AU MCU code extraction
AT32UC3A0512AU MCU code extraction, atmel MCU reverse, atmel ic reverse,atmel PCB board cloning, atmel chip decryption .
The high-performance, low-power 32-bit AVR RISC-based microcontroller combines 512KB flash, 64KB SRAM, 10/100 ethernet MAC, full-speed (12 Mbps) USB 2.0 with embedded host capability, I2S, and a built-in audio D/A converter.
This device features SRAM/SDRAM external bus interface and achieves 91 Dhrystone MIPS (DMIPS) at 66MHz while consuming only 40mA at 3.3V.
The Peripheral Direct Memory Access (PDCA) controller transfers data between peripherals and memories without processor involvement, drastically reducing processing with continuous large data streams within the MCU.
The AT32UC3A0512AU is the Audio version of the AT32UC3A0512. It allows the execution of Atmel licensed Audio firmware IPs.
Two versions are available:
AT32UC3A0512AU-ALUT: LQFP144, industrial (-40°C to +85°C), tray conditioning.
AT32UC3A0512AU-ALTRA: LQFP144, automotive (-40°C to +85°C), reel conditioning.
The high-performance, low-power 32-bit AVR RISC-based microcontroller combines 512KB flash, 64KB SRAM, 10/100 ethernet MAC, full-speed (12 Mbps) USB 2.0 with embedded host capability, I2S, and a built-in audio D/A converter.
This device features SRAM/SDRAM external bus interface and achieves 91 Dhrystone MIPS (DMIPS) at 66MHz while consuming only 40mA at 3.3V.
The Peripheral Direct Memory Access (PDCA) controller transfers data between peripherals and memories without processor involvement, drastically reducing processing with continuous large data streams within the MCU.
The AT32UC3A0512AU is the Audio version of the AT32UC3A0512. It allows the execution of Atmel licensed Audio firmware IPs.
Two versions are available:
AT32UC3A0512AU-ALUT: LQFP144, industrial (-40°C to +85°C), tray conditioning.
AT32UC3A0512AU-ALTRA: LQFP144, automotive (-40°C to +85°C), reel conditioning.
AT32UC3A0256AU MCU code extraction
AT32UC3A0256AU MCU code extraction, atmel MCU reverse, atmel ic reverse,atmel PCB board cloning, atmel chip decryption .
The high-performance, low-power 32-bit AVR RISC-based microcontroller combines 256KB flash, 64KB SRAM, 10/100 ethernet MAC, full-speed (12 Mbps) USB 2.0 with embedded host capability, I2S, and a built-in audio D/A converter.
This device features SRAM/SDRAM external bus interface and achieves 91 Dhrystone MIPS (DMIPS) at 66MHz while consuming only 40mA at 3.3V.
The Peripheral Direct Memory Access (PDCA) controller transfers data between peripherals and memories without processor involvement, drastically reducing processing with continuous large data streams within the MCU.
The AT32UC3A0256AU is the Audio version of the AT32UC3A0256. It allows the execution of Atmel licensed Audio firmware IPs.
One version is available:
AT32UC3A0256AU-ALUT: LQFP144, industrial (-40°C to +85°C), tray conditioning.
The high-performance, low-power 32-bit AVR RISC-based microcontroller combines 256KB flash, 64KB SRAM, 10/100 ethernet MAC, full-speed (12 Mbps) USB 2.0 with embedded host capability, I2S, and a built-in audio D/A converter.
This device features SRAM/SDRAM external bus interface and achieves 91 Dhrystone MIPS (DMIPS) at 66MHz while consuming only 40mA at 3.3V.
The Peripheral Direct Memory Access (PDCA) controller transfers data between peripherals and memories without processor involvement, drastically reducing processing with continuous large data streams within the MCU.
The AT32UC3A0256AU is the Audio version of the AT32UC3A0256. It allows the execution of Atmel licensed Audio firmware IPs.
One version is available:
AT32UC3A0256AU-ALUT: LQFP144, industrial (-40°C to +85°C), tray conditioning.
AT32UC3A0256 MCU code extraction
AT32UC3A0256 MCU code extraction, atmel MCU reverse, atmel ic reverse,atmel PCB board cloning, atmel chip decryption .
The high-performance, low-power 32-bit AVR RISC-based microcontroller combines 256KB flash, 64KB SRAM, 10/100 ethernet MAC, full-speed (12 Mbps) USB 2.0 with embedded host capability, I2S, and a built-in audio D/A converter.
This device features SRAM/SDRAM external bus interface and achieves 91 Dhrystone MIPS (DMIPS) at 66MHz while consuming only 40mA at 3.3V.
The Peripheral Direct Memory Access (PDCA) controller transfers data between peripherals and memories without processor involvement, drastically reducing processing with continuous large data streams within the MCU.
The high-performance, low-power 32-bit AVR RISC-based microcontroller combines 256KB flash, 64KB SRAM, 10/100 ethernet MAC, full-speed (12 Mbps) USB 2.0 with embedded host capability, I2S, and a built-in audio D/A converter.
This device features SRAM/SDRAM external bus interface and achieves 91 Dhrystone MIPS (DMIPS) at 66MHz while consuming only 40mA at 3.3V.
The Peripheral Direct Memory Access (PDCA) controller transfers data between peripherals and memories without processor involvement, drastically reducing processing with continuous large data streams within the MCU.
AT32UC3A0128AU MCU code extraction
AT32UC3A0128AU MCU code extraction, AT32UC3A0128AU atmel MCU reverse, atmel ic reverse,atmel PCB board cloning, atmel chip decryption .
The high-performance, low-power 32-bit AVR RISC-based microcontroller combines 128KB flash, 32KB SRAM, 10/100 ethernet MAC, full-speed (12 Mbps) USB 2.0 with embedded host capability, I2S, and a built-in audio D/A converter.
This device features SRAM/SDRAM external bus interface and achieves 91 Dhrystone MIPS (DMIPS) at 66MHz while consuming only 40mA at 3.3V.
The Peripheral Direct Memory Access (PDCA) controller transfers data between peripherals and memories without processor involvement, drastically reducing processing with continuous large data streams within the MCU.
The AT32UC3A0128AU is the Audio version of the AT32UC3A0128. It allows the execution of Atmel licensed Audio firmware IPs.
One version is available:
AT32UC3A0128AU-ALUT: LQFP144, industrial (-40°C to +85°C), tray conditioning.
The high-performance, low-power 32-bit AVR RISC-based microcontroller combines 128KB flash, 32KB SRAM, 10/100 ethernet MAC, full-speed (12 Mbps) USB 2.0 with embedded host capability, I2S, and a built-in audio D/A converter.
This device features SRAM/SDRAM external bus interface and achieves 91 Dhrystone MIPS (DMIPS) at 66MHz while consuming only 40mA at 3.3V.
The Peripheral Direct Memory Access (PDCA) controller transfers data between peripherals and memories without processor involvement, drastically reducing processing with continuous large data streams within the MCU.
The AT32UC3A0128AU is the Audio version of the AT32UC3A0128. It allows the execution of Atmel licensed Audio firmware IPs.
One version is available:
AT32UC3A0128AU-ALUT: LQFP144, industrial (-40°C to +85°C), tray conditioning.
AT32UC3A0128 MCU code extraction
AT32UC3A0128 MCU code extraction, AT19SAM7S128 atmel MCU reverse, atmel ic reverse,atmel PCB board cloning, atmel chip decryption .
The high-performance, low-power 32-bit AVR RISC-based microcontroller combines 128KB flash, 32KB SRAM, 10/100 ethernet MAC, full-speed (12 Mbps) USB 2.0 with embedded host capability, I2S, and a built-in audio D/A converter.
This device features SRAM/SDRAM external bus interface and achieves 91 Dhrystone MIPS (DMIPS) at 66MHz while consuming only 40mA at 3.3V.
The Peripheral Direct Memory Access (PDCA) controller transfers data between peripherals and memories without processor involvement, drastically reducing processing with continuous large data streams within the MCU.
The high-performance, low-power 32-bit AVR RISC-based microcontroller combines 128KB flash, 32KB SRAM, 10/100 ethernet MAC, full-speed (12 Mbps) USB 2.0 with embedded host capability, I2S, and a built-in audio D/A converter.
This device features SRAM/SDRAM external bus interface and achieves 91 Dhrystone MIPS (DMIPS) at 66MHz while consuming only 40mA at 3.3V.
The Peripheral Direct Memory Access (PDCA) controller transfers data between peripherals and memories without processor involvement, drastically reducing processing with continuous large data streams within the MCU.
AT19SAM7S128 MCU code extraction
AT19SAM7S128 MCU code extraction, AT19SAM7S128 atmel MCU reverse, atmel ic reverse,atmel PCB board cloning, atmel chip decryption .
A member of the Atmel® SAM7S series of flash microcontrollers based on the 32-bit ARM7TDMI™ RISC processor. It operates at a maximum speed of 55MHz and features 128KB of flash and 32KB of SRAM. The peripheral set includes a FS USB device and Phy at 12Mbps, UART, two USARTs, TWI, SPI, SSC,PWM timers, three 16-bit timers, RTT, 8x10-bit ADC and 32 IO lines. It achieves single-cycle instruction access from embedded flash at 27 MIPS. The multi-layer bus matrix, multiple SRAM banks, PDC, and DMA support parallel tasks and maximize data throughput. The SAM7S128 operates from 1.65V to 3.6V and is available in 64-pin LQFP and QFN packages.
A member of the Atmel® SAM7S series of flash microcontrollers based on the 32-bit ARM7TDMI™ RISC processor. It operates at a maximum speed of 55MHz and features 128KB of flash and 32KB of SRAM. The peripheral set includes a FS USB device and Phy at 12Mbps, UART, two USARTs, TWI, SPI, SSC,PWM timers, three 16-bit timers, RTT, 8x10-bit ADC and 32 IO lines. It achieves single-cycle instruction access from embedded flash at 27 MIPS. The multi-layer bus matrix, multiple SRAM banks, PDC, and DMA support parallel tasks and maximize data throughput. The SAM7S128 operates from 1.65V to 3.6V and is available in 64-pin LQFP and QFN packages.
Friday, August 31, 2012
semiconductor solutions
STMicroelectronics is a global independent semiconductor company and is a leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivaled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence trends. The Company currently offers over 3,000 main types of products to more than 1,500 customers, including Alcatel, Bosch, DaimlerChrysler, Ford, Hewlett-Packard, IBM, Motorola, Nokia, Nortel Networks, Philips, Seagate Technology, Siemens, Sony, Thomson and Western Digital. The ST group was formed in June 1987 as a result of the merger between SGS Microelettronica of Italy and Thomson Semiconducteurs of France. In May 1998, the company changed its name from SGS-THOMSON Microelectronics to STMicroelectronics. The group totals more than 43,000 employees, 16 advanced research and development units, 39 design and application centers, 17 main manufacturing sites and 88 sales offices in 31 countries.ST's technical, marketing and manufacturing strengths are matched and further enhanced by an unswerving commitment to Total Quality and Environmental Management (TQEM) that has earned prestigious awards around the world.
ST6 series MCU crack
ST MCU crack/chip crack ST6 series MCU crack
The 8-bit ST6 platform is simple, robust and cost-sensitive. Housed in 16- to 28-pin packages, the ST6 devices integrate 1 to 4 Kbytes of OTP (one-time programmable) or ROM memory. It has been widely used in home application, digital consumer equipment and motor control.
We can decrypt all the series of ST62T and ST62E, all the OTP series can be cracked.
ST MCU crack/chip crack ST7 series MCU crackST 7 is the STMicroelectrnics 8-bit rapidly growing product. The ST7 core is based on an industry-standard 8-bit architecture. It supports high-level language programming and also provides interrupt handling features. In addition, it has the flexibility of Flash programming and the required robustness for multi-segment purposes.
ST72F series MCU crack
ST72F321 ST72F321A ST72F321BA ST72F321B ST72F324 ST72F324B ST72F324L ST72F325 ST72F324L ST72F325 ST72F325A ST72F32A ST72F340 ST72F344 ST72F345 ST72F361 ST72F361A ST72F561 ST72F561A ST72F60 ST72F60B ST72F621 ST72F622 ST72F623 ST72F63 ST72F63B ST72F651
The 8-bit ST6 platform is simple, robust and cost-sensitive. Housed in 16- to 28-pin packages, the ST6 devices integrate 1 to 4 Kbytes of OTP (one-time programmable) or ROM memory. It has been widely used in home application, digital consumer equipment and motor control.
We can decrypt all the series of ST62T and ST62E, all the OTP series can be cracked.
ST MCU crack/chip crack ST7 series MCU crackST 7 is the STMicroelectrnics 8-bit rapidly growing product. The ST7 core is based on an industry-standard 8-bit architecture. It supports high-level language programming and also provides interrupt handling features. In addition, it has the flexibility of Flash programming and the required robustness for multi-segment purposes.
ST72F series MCU crack
ST72F321 ST72F321A ST72F321BA ST72F321B ST72F324 ST72F324B ST72F324L ST72F325 ST72F324L ST72F325 ST72F325A ST72F32A ST72F340 ST72F344 ST72F345 ST72F361 ST72F361A ST72F561 ST72F561A ST72F60 ST72F60B ST72F621 ST72F622 ST72F623 ST72F63 ST72F63B ST72F651
ST72F series MCU crack
ST72F series MCU crack
ST72F321 ST72F321A ST72F321BA ST72F321B ST72F324 ST72F324B ST72F324L ST72F325 ST72F324L ST72F325 ST72F325A ST72F32A ST72F340 ST72F344 ST72F345 ST72F361 ST72F361A ST72F561 ST72F561A ST72F60 ST72F60B ST72F621 ST72F622 ST72F623 ST72F63 ST72F63B ST72F651
ST7FMC series MCU crack
ST7FMC1K2 ST7FMC1K4 ST7FMC1K6 ST7FMC2M9 ST7FMC2N6 ST7FMC2N7 ST7FMC2R6 ST7F2R7 ST7FMC2S4 ST7FMC2S5 ST7FMC2S6 ST7FMC2S7
ST ARM crack/break/attack STM32F103 series crack STM32F103V8 break STM32F0103VB attack
ST72F321 ST72F321A ST72F321BA ST72F321B ST72F324 ST72F324B ST72F324L ST72F325 ST72F324L ST72F325 ST72F325A ST72F32A ST72F340 ST72F344 ST72F345 ST72F361 ST72F361A ST72F561 ST72F561A ST72F60 ST72F60B ST72F621 ST72F622 ST72F623 ST72F63 ST72F63B ST72F651
ST7FMC series MCU crack
ST7FMC1K2 ST7FMC1K4 ST7FMC1K6 ST7FMC2M9 ST7FMC2N6 ST7FMC2N7 ST7FMC2R6 ST7F2R7 ST7FMC2S4 ST7FMC2S5 ST7FMC2S6 ST7FMC2S7
ST ARM crack/break/attack STM32F103 series crack STM32F103V8 break STM32F0103VB attack
ST7FMC series MCU crack
ST7FMC series MCU crack
ST7FMC1K2 ST7FMC1K4 ST7FMC1K6 ST7FMC2M9 ST7FMC2N6 ST7FMC2N7 ST7FMC2R6 ST7F2R7 ST7FMC2S4 ST7FMC2S5 ST7FMC2S6 ST7FMC2S7
ST ARM crack/break/attack STM32F103 series crack STM32F103V8 break STM32F0103VB attack
The STM32 family of 32 bit Flash microcontrollers based on the ARM Cortex™ M processor is designed to offer new degrees of freedom to MCU users.
ST7FMC1K2 ST7FMC1K4 ST7FMC1K6 ST7FMC2M9 ST7FMC2N6 ST7FMC2N7 ST7FMC2R6 ST7F2R7 ST7FMC2S4 ST7FMC2S5 ST7FMC2S6 ST7FMC2S7
ST ARM crack/break/attack STM32F103 series crack STM32F103V8 break STM32F0103VB attack
The STM32 family of 32 bit Flash microcontrollers based on the ARM Cortex™ M processor is designed to offer new degrees of freedom to MCU users.
STM32 devices
It offers 32 bit product range that combines high performance, real time capabilities, digital signal processing, and low power, low voltage operation, while maintaining full integration and ease of development. The unparalleled and large range of STM32 devices, based on an industry-standard core and accompanied by a vast choice of tools and software, makes this family of products the ideal choice, both for small projects and for entire platform decisions. Sichip can provide the whole series of STM32 chip crack service.
STR711 STR715 STR750 STR755 STR910 STR911 STR912
STM32F103C4 STM32F103C6 STM32F103C8 STM32F103CB
STM32F103R4 STM32F103R6 STM32F103R8 STM32F103RB STM32F103RC STM32F103RD STM32F103RE STM32F103RF
STMS32F103T4 STM32F103T6 STM32F103T8
STM32F103V8 STM32F103VB STM32F103VC STM32F103VD STM32F103VE STM32F103VF STM32F103VG
STM32F103EC STM32F103ED STM32F103EF STM32F103EG
For more ST ARM crack model, please contact us.
STR711 STR715 STR750 STR755 STR910 STR911 STR912
STM32F103C4 STM32F103C6 STM32F103C8 STM32F103CB
STM32F103R4 STM32F103R6 STM32F103R8 STM32F103RB STM32F103RC STM32F103RD STM32F103RE STM32F103RF
STMS32F103T4 STM32F103T6 STM32F103T8
STM32F103V8 STM32F103VB STM32F103VC STM32F103VD STM32F103VE STM32F103VF STM32F103VG
STM32F103EC STM32F103ED STM32F103EF STM32F103EG
For more ST ARM crack model, please contact us.
ST7FMC series MCU crack
ST7FMC series MCU crack
ST7FMC1K2 ST7FMC1K4 ST7FMC1K6 ST7FMC2M9 ST7FMC2N6 ST7FMC2N7 ST7FMC2R6 ST7F2R7 ST7FMC2S4 ST7FMC2S5 ST7FMC2S6 ST7FMC2S7
ST ARM crack/break/attack STM32F103 series crack STM32F103V8 break STM32F0103VB attack
The STM32 family of 32 bit Flash microcontrollers based on the ARM Cortex™ M processor is designed to offer new degrees of freedom to MCU users. It offers 32 bit product range that combines high performance, real time capabilities, digital signal processing, and low power, low voltage operation, while maintaining full integration and ease of development. The unparalleled and large range of STM32 devices, based on an industry-standard core and accompanied by a vast choice of tools and software, makes this family of products the ideal choice, both for small projects and for entire platform decisions. Sichip can provide the whole series of STM32 chip crack service.
STR711 STR715 STR750 STR755 STR910 STR911 STR912
STM32F103C4 STM32F103C6 STM32F103C8 STM32F103CB
STM32F103R4 STM32F103R6 STM32F103R8 STM32F103RB STM32F103RC STM32F103RD STM32F103RE STM32F103RF
STMS32F103T4 STM32F103T6 STM32F103T8
STM32F103V8 STM32F103VB STM32F103VC STM32F103VD STM32F103VE STM32F103VF STM32F103VG
STM32F103EC STM32F103ED STM32F103EF STM32F103EG
For more ST ARM crack model, please contact us.
ST7FMC1K2 ST7FMC1K4 ST7FMC1K6 ST7FMC2M9 ST7FMC2N6 ST7FMC2N7 ST7FMC2R6 ST7F2R7 ST7FMC2S4 ST7FMC2S5 ST7FMC2S6 ST7FMC2S7
ST ARM crack/break/attack STM32F103 series crack STM32F103V8 break STM32F0103VB attack
The STM32 family of 32 bit Flash microcontrollers based on the ARM Cortex™ M processor is designed to offer new degrees of freedom to MCU users. It offers 32 bit product range that combines high performance, real time capabilities, digital signal processing, and low power, low voltage operation, while maintaining full integration and ease of development. The unparalleled and large range of STM32 devices, based on an industry-standard core and accompanied by a vast choice of tools and software, makes this family of products the ideal choice, both for small projects and for entire platform decisions. Sichip can provide the whole series of STM32 chip crack service.
STR711 STR715 STR750 STR755 STR910 STR911 STR912
STM32F103C4 STM32F103C6 STM32F103C8 STM32F103CB
STM32F103R4 STM32F103R6 STM32F103R8 STM32F103RB STM32F103RC STM32F103RD STM32F103RE STM32F103RF
STMS32F103T4 STM32F103T6 STM32F103T8
STM32F103V8 STM32F103VB STM32F103VC STM32F103VD STM32F103VE STM32F103VF STM32F103VG
STM32F103EC STM32F103ED STM32F103EF STM32F103EG
For more ST ARM crack model, please contact us.
crack ST7 series MCU
ST MCU crack/chip crack ST7 series MCU crackST 7 is the STMicroelectrnics 8-bit rapidly growing product. The ST7 core is based on an industry-standard 8-bit architecture. It supports high-level language programming and also provides interrupt handling features. In addition, it has the flexibility of Flash programming and the required robustness for multi-segment purposes.
ST72F series MCU crack
ST72F321 ST72F321A ST72F321BA ST72F321B ST72F324 ST72F324B ST72F324L ST72F325 ST72F324L ST72F325 ST72F325A ST72F32A ST72F340 ST72F344 ST72F345 ST72F361 ST72F361A ST72F561 ST72F561A ST72F60 ST72F60B ST72F621 ST72F622 ST72F623 ST72F63 ST72F63B ST72F651
ST72F series MCU crack
ST72F321 ST72F321A ST72F321BA ST72F321B ST72F324 ST72F324B ST72F324L ST72F325 ST72F324L ST72F325 ST72F325A ST72F32A ST72F340 ST72F344 ST72F345 ST72F361 ST72F361A ST72F561 ST72F561A ST72F60 ST72F60B ST72F621 ST72F622 ST72F623 ST72F63 ST72F63B ST72F651
ST6 series MCU crack
ST MCU crack/chip crack ST6 series MCU crack
The 8-bit ST6 platform is simple, robust and cost-sensitive. Housed in 16- to 28-pin packages, the ST6 devices integrate 1 to 4 Kbytes of OTP (one-time programmable) or ROM memory. It has been widely used in home application, digital consumer equipment and motor control.
We can decrypt all the series of ST62T and ST62E, all the OTP series can be cracked.
ST MCU crack/chip crack ST7 series MCU crackST 7 is the STMicroelectrnics 8-bit rapidly growing product. The ST7 core is based on an industry-standard 8-bit architecture. It supports high-level language programming and also provides interrupt handling features. In addition, it has the flexibility of Flash programming and the required robustness for multi-segment purposes.
The 8-bit ST6 platform is simple, robust and cost-sensitive. Housed in 16- to 28-pin packages, the ST6 devices integrate 1 to 4 Kbytes of OTP (one-time programmable) or ROM memory. It has been widely used in home application, digital consumer equipment and motor control.
We can decrypt all the series of ST62T and ST62E, all the OTP series can be cracked.
ST MCU crack/chip crack ST7 series MCU crackST 7 is the STMicroelectrnics 8-bit rapidly growing product. The ST7 core is based on an industry-standard 8-bit architecture. It supports high-level language programming and also provides interrupt handling features. In addition, it has the flexibility of Flash programming and the required robustness for multi-segment purposes.
SGS-THOMSON Microelectronics
In May 1998, the company changed its name from SGS-THOMSON Microelectronics to STMicroelectronics. The group totals more than 43,000 employees, 16 advanced research and development units, 39 design and application centers, 17 main manufacturing sites and 88 sales offices in 31 countries.ST's technical, marketing and manufacturing strengths are matched and further enhanced by an unswerving commitment to Total Quality and Environmental Management (TQEM) that has earned prestigious awards around the world.
Tuesday, August 14, 2012
TMS320 IDMA3 Channel Request Descriptor (IDMA3_ChannelRec)
TMS320 IDMA3 Channel Request Descriptor (IDMA3_ChannelRec)
Handle Handle to logical DMA channel
numTransfers Number of DMA transfers that are submitted using this logical channel handle. Single (==1) or Linked ( >= 2)
numWaits Number of individual transfers that can be waited in a linked start. (1 for single transfers or to wait for all transfers to complete.)
priority Relative priority recommendation {Urgent, High, Medium, Low}.
protocol Optional protocol handle for allocating channel environment (“env”) memory and calling custom channel initialization function.
persistent When persistent is set to TRUE, the granted physical EDMA resources (PaRAMs and TCCs) are for exclusive use by this channel. They cannot be shared with any other IDMA3 channel.
Handle Handle to logical DMA channel
numTransfers Number of DMA transfers that are submitted using this logical channel handle. Single (==1) or Linked ( >= 2)
numWaits Number of individual transfers that can be waited in a linked start. (1 for single transfers or to wait for all transfers to complete.)
priority Relative priority recommendation {Urgent, High, Medium, Low}.
protocol Optional protocol handle for allocating channel environment (“env”) memory and calling custom channel initialization function.
persistent When persistent is set to TRUE, the granted physical EDMA resources (PaRAMs and TCCs) are for exclusive use by this channel. They cannot be shared with any other IDMA3 channel.
TMS320 IDMA3 Functions Description
TMS320 IDMA3 Functions Description
dmaChangeChannels() Called by an application whenever logical channels are moved at run-time.
dmaGetChannelCnt() Called by an application to query an algorithm about its number of logical DMA channel requests.
dmaGetChannels() Called by an application to query an algorithm about its DMA channel requests at initialization time, or to get the current channel holdings.
dmaInit() Called by an application to grant DMA handle(s) to the algorithm at initialization.
TMS320 Framework Components DMAN3ACPY3 Users Guide
TMS320 Framework Components DMAN3ACPY3 Users Guide
The direct memory access (DMA) controller performs asynchronously scheduled data transfers between memory regions without the intervention of the CPU. The parallel operation of the DMA with the execution of the CPU relieves the CPU of the burden of these data transfers. This allows a system to achieve greater throughput.
Algorithms and client applications may want to take advantage of the DMA to overlap data movement with CPU processing. However, XDAIS does not allow compliant algorithms to directly access or control any hardware peripherals, including the DMA. All system DMA resources must be controlled by the client application.
The new Framework Components DMA utilities allow XDAIS algorithms and client applications to utilize DMA resources by providing standard DMA software abstractions and interfaces. Framework Components now includes the following DMA modules and interfaces:
IDMA3. This is the standard interface to algorithms for DMA resource specification and negotiation protocols. This interface allows the client application to query and provide the algorithm its requested DMA resources.
DMAN3. This is the DMA resource manager. It is responsible for managing and granting DMA resources to algorithms and applications based on the IDMA3 interface.
ACPY3. This is the functional DMA interface and library. The ACPY3 interface describes a comprehensive list of DMA operations that an algorithm can perform on the logical DMA channels acquired through the IDMA3 protocol. These functions are implemented as part of the client application and are called by the algorithm.
The following figure shows which modules are implemented by client application frameworks and which are implemented by algorithms or components. Arrows indicate which modules use other modules.
Client applications use the algorithm's IDMA3 interface to query the algorithm's DMA resource requirements and grant the algorithm logical DMA resources via handles. Each granted handle provides the algorithm a uniform, private logical DMA channel abstraction. Algorithms, upon getting provisioned by the framework with their DMA resource needs, may call ACPY3 functions to schedule DMA transfers on the logical DMA channels. Alternatively, algorithms may provide their own DMA functions to program the physical DMA resources acquired through the IDMA3 protocol.
The basic ideas and objectives described in the "Use of the DMA Resource" chapter of TMS320 DSP Algorithm Standard Rules and Guidelines (SPRU352) apply to the design, implementation and use of the ACPY3 and IDMA3 interfaces. Collectively, IDMA3, DMAN3, and ACPY3 provide a flexible and efficient model that greatly simplifies the management of system DMA resources and services by the client application. They also provide a simple and powerful mechanism for algorithms to configure and access DMA services.
The following tables summarize the API functions and structures used by the IDMA3, ACPY3, and DMAN3 interfaces.
The direct memory access (DMA) controller performs asynchronously scheduled data transfers between memory regions without the intervention of the CPU. The parallel operation of the DMA with the execution of the CPU relieves the CPU of the burden of these data transfers. This allows a system to achieve greater throughput.
Algorithms and client applications may want to take advantage of the DMA to overlap data movement with CPU processing. However, XDAIS does not allow compliant algorithms to directly access or control any hardware peripherals, including the DMA. All system DMA resources must be controlled by the client application.
The new Framework Components DMA utilities allow XDAIS algorithms and client applications to utilize DMA resources by providing standard DMA software abstractions and interfaces. Framework Components now includes the following DMA modules and interfaces:
IDMA3. This is the standard interface to algorithms for DMA resource specification and negotiation protocols. This interface allows the client application to query and provide the algorithm its requested DMA resources.
DMAN3. This is the DMA resource manager. It is responsible for managing and granting DMA resources to algorithms and applications based on the IDMA3 interface.
ACPY3. This is the functional DMA interface and library. The ACPY3 interface describes a comprehensive list of DMA operations that an algorithm can perform on the logical DMA channels acquired through the IDMA3 protocol. These functions are implemented as part of the client application and are called by the algorithm.
The following figure shows which modules are implemented by client application frameworks and which are implemented by algorithms or components. Arrows indicate which modules use other modules.
Client applications use the algorithm's IDMA3 interface to query the algorithm's DMA resource requirements and grant the algorithm logical DMA resources via handles. Each granted handle provides the algorithm a uniform, private logical DMA channel abstraction. Algorithms, upon getting provisioned by the framework with their DMA resource needs, may call ACPY3 functions to schedule DMA transfers on the logical DMA channels. Alternatively, algorithms may provide their own DMA functions to program the physical DMA resources acquired through the IDMA3 protocol.
The basic ideas and objectives described in the "Use of the DMA Resource" chapter of TMS320 DSP Algorithm Standard Rules and Guidelines (SPRU352) apply to the design, implementation and use of the ACPY3 and IDMA3 interfaces. Collectively, IDMA3, DMAN3, and ACPY3 provide a flexible and efficient model that greatly simplifies the management of system DMA resources and services by the client application. They also provide a simple and powerful mechanism for algorithms to configure and access DMA services.
The following tables summarize the API functions and structures used by the IDMA3, ACPY3, and DMAN3 interfaces.
Monday, July 16, 2012
Who Invent PCB
The Austrian Jewish engineer Paul Eisler invented the printed circuit while working in England around 1936 as part of a radio set. Around 1943 the USA began to use the technology on a large scale to make proximity fuses for use in World War II . After the war, in 1948, the USA released the invention for commercial use. Printed circuits did not become commonplace in consumer electronics until the mid-1950s, after the Auto-Sembly process was developed by the United States Army.
Before printed circuits (and for a while after their invention), point-to-point construction was used. For prototypes, or small production runs, wire wrap or turret board can be more efficient. Predating the printed circuit invention, and similar in spirit, was John Sargrove's 1936–1947 Electronic Circuit Making Equipment (ECME) which sprayed metal onto a Bakelite plastic board. The ECME could produce 3 radios per minute.
Before printed circuits (and for a while after their invention), point-to-point construction was used. For prototypes, or small production runs, wire wrap or turret board can be more efficient. Predating the printed circuit invention, and similar in spirit, was John Sargrove's 1936–1947 Electronic Circuit Making Equipment (ECME) which sprayed metal onto a Bakelite plastic board. The ECME could produce 3 radios per minute.
Monday, June 25, 2012
MCU CRACK Engineering
Beijing Techip provide MCU crack and decryption service for all Z86Eserial MCU, part of the Z86E serial models are listed below:
Z86E03 Z86E04 Z86E06 Z86E07 Z86E08 Z86E11 Z86E122 Z86E123 Z86E124 Z86E125 Z86E126 Z86E132 Z86E133 Z86E134 Z86E135 Z86E136 Z86E142 Z86E143 Z86E144 Z86E145 Z86E146 Z86E18 Z86E21 Z86E23 Z86E30 Z86E31 Z86E33 Z86E34 Z86E40 Z86E43 Z86E44 Z86E61 Z86E63 Z86E73 Z86E74 Z86E83 Z89371 Z86E001 Z8PE00 Z8PE003
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Wednesday, June 6, 2012
Transit of Venus
This afternoon, Venus began its "transit" across the face of the sun as
the planet passed directly between the Sun and Earth, a rare and
spectacular sight for skywatchers. The next transit will take place in
2117.
Monday, May 28, 2012
Virus Infects Computers Across Middle East
A complex computer virus has been pilfering confidential information
from computers in the Middle East for at least two years, according to a
security report released on Monday.
The virus, called Flame, has been infecting computers in Iran, Israel, Lebanon, Sudan, Syria, Saudi Arabia and Egypt. It has been grabbing images of users’ computer screens, recording their instant messaging chats, remotely turning on their microphones to record their audio conversations and monitoring their keystrokes and network traffic, according to a report by Kaspersky Labs, a Moscow-based security research firm.
If the report’s findings prove to be true, Flame would be the third major Internet weapon to have been discovered since 2010. The first, named Stuxnet, was intended to attack software in specialized industrial equipment, and was used to destroy centrifuges in an Iranian nuclear facility in 2010. The second virus, called Duqu, like Flame, performed reconnaissance. Security researchers believe Duqu was created by the same group of programmers behind Stuxnet.
The researchers said Flame appeared to have been developed by a different group of programmers. It contains 20 times more code than Stuxnet and is much more widespread than Duqu. Researchers believe Duqu hit fewer than 50 targets worldwide. Kaspersky’s researchers said they had detected Flame on thousands of computers belonging to individuals, private companies and universities across the Middle East.
“Flame can easily be described as one of the most complex threats ever discovered,” Alexander Gostev, the head of Kaspersky’s Global Research and Analysis team, wrote in a blog post on Monday. “It’s big and incredibly sophisticated. It pretty much redefines the notion of cyberwar and cyberespionage.”
Researchers say they do not know who is behind the virus, but given its complexity and the geography of its targets, they said it was most likely being staged by a government. The authors of Stuxnet and Duqu are also unknown but their targets and digital evidence suggest to some researchers that they may have been part of a joint American-Israeli project to sabotage Iran’s nuclear program.
Kaspersky’s researchers said the majority of computers infected with Flame were located in Iran. Like Duqu and Stuxnet, Flame infects machines through a known security hole in the Windows operating software.
Researchers discovered Flame while investigating reports that another computer virus, called Wiper, had been erasing computer programs in Iran. The International Telecommunications Union, a United Nations agency, had asked Kaspersky’s researchers to look into Wiper when they discovered that thousands more computers had been infected with Flame.
The virus, called Flame, has been infecting computers in Iran, Israel, Lebanon, Sudan, Syria, Saudi Arabia and Egypt. It has been grabbing images of users’ computer screens, recording their instant messaging chats, remotely turning on their microphones to record their audio conversations and monitoring their keystrokes and network traffic, according to a report by Kaspersky Labs, a Moscow-based security research firm.
If the report’s findings prove to be true, Flame would be the third major Internet weapon to have been discovered since 2010. The first, named Stuxnet, was intended to attack software in specialized industrial equipment, and was used to destroy centrifuges in an Iranian nuclear facility in 2010. The second virus, called Duqu, like Flame, performed reconnaissance. Security researchers believe Duqu was created by the same group of programmers behind Stuxnet.
The researchers said Flame appeared to have been developed by a different group of programmers. It contains 20 times more code than Stuxnet and is much more widespread than Duqu. Researchers believe Duqu hit fewer than 50 targets worldwide. Kaspersky’s researchers said they had detected Flame on thousands of computers belonging to individuals, private companies and universities across the Middle East.
“Flame can easily be described as one of the most complex threats ever discovered,” Alexander Gostev, the head of Kaspersky’s Global Research and Analysis team, wrote in a blog post on Monday. “It’s big and incredibly sophisticated. It pretty much redefines the notion of cyberwar and cyberespionage.”
Researchers say they do not know who is behind the virus, but given its complexity and the geography of its targets, they said it was most likely being staged by a government. The authors of Stuxnet and Duqu are also unknown but their targets and digital evidence suggest to some researchers that they may have been part of a joint American-Israeli project to sabotage Iran’s nuclear program.
Kaspersky’s researchers said the majority of computers infected with Flame were located in Iran. Like Duqu and Stuxnet, Flame infects machines through a known security hole in the Windows operating software.
Researchers discovered Flame while investigating reports that another computer virus, called Wiper, had been erasing computer programs in Iran. The International Telecommunications Union, a United Nations agency, had asked Kaspersky’s researchers to look into Wiper when they discovered that thousands more computers had been infected with Flame.
Thursday, May 3, 2012
Read full story Invensas Targets Ultrabooks and Tablet Applications with DIMM-IN-A-PACKAGE Solution Based on xFD Technology Invensas Targets Ultrabooks and Tablet Applications
Invensas Corporation today introduced its DIMM-IN-A-PACKAGE multi-die
face-down (xFD)TM technology for thin and light notebooks, also known as
UltrabooksTM, and tablet computers. Invensas' novel solution delivers
the memory capacity and performance of a small outline dual in-line memory module (SODIMM) in a miniature, soldered-down, ball grid array (BGA) package.
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