CY7C028-15AI MCU Code Reading, Programm Reading, MCU Crack,
Chip Decryption.
Features
True dual-ported memory cells which allow
simultaneous access of the same memory location
32K x 16 organization (CY7C027V/027AV
64K x 16 organization (CY7C028V)
32K x 18 organization (CY7C037AV)
64K x 18 organization (CY7C038V)
0.35 micron Complementary metal oxide semiconductor
(CMOS) for optimum speed and power
High speed access: 15, 20, and 25 ns
Low operating power
Active: ICC = 115 mA (typical)
Standby: ISB3
= 10 A (typical)
Fully asynchronous operation
Automatic power-down
Expandable data bus to 32/36 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flag for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and Industrial temperature ranges
100-pin Pb-free Thin quad plastic flatpack (TQFP) and 100-pin
TQFP
Tuesday, October 16, 2012
Monday, September 17, 2012
handler index
Motion
Throughput Up to 1400 UPH (units per hour) handler index time with zero programming time for SuperBOT-I
Content High performance control card & servo drive system.
Resolution X axis: (+/-)0.02mm; Y axis:(+/-) 0.02mm; Z axis: (+/-)0.05mm.
Max. stroke X axis: 500 mm; Y axis: 380mm; Z axis:60mm.
Pick & Place head placement accuracy (+/-) 0.08mm.
Vision System
Camera 400*400 pixels.
Vision resolution 0.1mm.
Process time per view ~0.5sec.
I/O Devices
Tray : It is the standard I/O device of the machine. Users provide the type and three special positions of the tray, and the system can calculate the position of each chip on the tray.
Auto tray : This device includes tray in and tray out. Users can put 10 trays into the device. When the machine is running, users can add trays or take out trays without stopping the machine.
Tape-in Device : An input device for tapes with IC packaging. It must be modified for custom IC size.
Tape-out Device : An output device for tapes with IC packaging. It handles tape widths of 12mm to 40mm. The tape can be air-pressed or heat-sealed.
Tube-In Device
Tube-Out Device
Assistant Control
Built-in Control : PC-based control with Windows XP.
Display : LCD monitor.
Data entry : Keyboard & mouse.
Throughput Up to 1400 UPH (units per hour) handler index time with zero programming time for SuperBOT-I
Content High performance control card & servo drive system.
Resolution X axis: (+/-)0.02mm; Y axis:(+/-) 0.02mm; Z axis: (+/-)0.05mm.
Max. stroke X axis: 500 mm; Y axis: 380mm; Z axis:60mm.
Pick & Place head placement accuracy (+/-) 0.08mm.
Vision System
Camera 400*400 pixels.
Vision resolution 0.1mm.
Process time per view ~0.5sec.
I/O Devices
Tray : It is the standard I/O device of the machine. Users provide the type and three special positions of the tray, and the system can calculate the position of each chip on the tray.
Auto tray : This device includes tray in and tray out. Users can put 10 trays into the device. When the machine is running, users can add trays or take out trays without stopping the machine.
Tape-in Device : An input device for tapes with IC packaging. It must be modified for custom IC size.
Tape-out Device : An output device for tapes with IC packaging. It handles tape widths of 12mm to 40mm. The tape can be air-pressed or heat-sealed.
Tube-In Device
Tube-Out Device
Assistant Control
Built-in Control : PC-based control with Windows XP.
Display : LCD monitor.
Data entry : Keyboard & mouse.
Built-in Programmer
Built-in Programmer
Programming systems are USB Interfaced 4 Ultra-high Speed Stand-alone Universal Device Programming units; SuperPro 5000
Hardware & electrical Specifications
Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU, Standard Logic.
Packages supported: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP
PC interface: USB2.0
Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output -; power:2KW
Mechanical parameter: Main unit: Size: 820*640*1550 mm Weight: 547 lbs (248 Kg.)=
Packing weight: 594 lbs (270 Kg.)
I/O Devices
I/O Devices
Tray : It is the standard I/O device of the machine. Users provide the type and three special positions of the tray, and the system can calculate the position of each chip on the tray.
Auto tray : This device includes tray in and tray out. Users can put 10 trays into the device. When the machine is running, users can add trays or take out trays without stopping the machine.
Tape-in Device : An input device for tapes with IC packaging. It must be modified for custom IC size.
Tape-out Device : An output device for tapes with IC packaging. It handles tape widths of 12mm to 40mm. The tape can be air-pressed or heat-sealed.
Tube-In Device
Tube-Out Device
Assistant Control
Built-in Control : PC-based control with Windows XP.
Display : LCD monitor.
Data entry : Keyboard & mouse.
Built-in Programmer
Programming systems are USB Interfaced 4 Ultra-high Speed Stand-alone Universal Device Programming units; SuperPro 5000
Hardware & electrical Specifications
Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU, Standard Logic.
Packages supported: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP
PC interface: USB2.0
Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output -; power:2KW
Mechanical parameter: Main unit: Size: 820*640*1550 mm Weight: 547 lbs (248 Kg.)=
Packing weight: 594 lbs (270 Kg.)
Tray : It is the standard I/O device of the machine. Users provide the type and three special positions of the tray, and the system can calculate the position of each chip on the tray.
Auto tray : This device includes tray in and tray out. Users can put 10 trays into the device. When the machine is running, users can add trays or take out trays without stopping the machine.
Tape-in Device : An input device for tapes with IC packaging. It must be modified for custom IC size.
Tape-out Device : An output device for tapes with IC packaging. It handles tape widths of 12mm to 40mm. The tape can be air-pressed or heat-sealed.
Tube-In Device
Tube-Out Device
Assistant Control
Built-in Control : PC-based control with Windows XP.
Display : LCD monitor.
Data entry : Keyboard & mouse.
Built-in Programmer
Programming systems are USB Interfaced 4 Ultra-high Speed Stand-alone Universal Device Programming units; SuperPro 5000
Hardware & electrical Specifications
Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU, Standard Logic.
Packages supported: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP
PC interface: USB2.0
Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output -; power:2KW
Mechanical parameter: Main unit: Size: 820*640*1550 mm Weight: 547 lbs (248 Kg.)=
Packing weight: 594 lbs (270 Kg.)
Built-in Programmer Xeltek SuperBOT-I Automated Handler
Built-in Programmer
Programming systems are USB Interfaced 4 Ultra-high Speed Stand-alone Universal Device Programming units; SuperPro 5000
Hardware & electrical Specifications
Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU, Standard Logic.
Packages supported: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP
PC interface: USB2.0
Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output -; power:2KW
Mechanical parameter: Main unit: Size: 820*640*1550 mm Weight: 547 lbs (248 Kg.)=
Packing weight: 594 lbs (270 Kg.)
Programming systems are USB Interfaced 4 Ultra-high Speed Stand-alone Universal Device Programming units; SuperPro 5000
Hardware & electrical Specifications
Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU, Standard Logic.
Packages supported: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP
PC interface: USB2.0
Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output -; power:2KW
Mechanical parameter: Main unit: Size: 820*640*1550 mm Weight: 547 lbs (248 Kg.)=
Packing weight: 594 lbs (270 Kg.)
Assistant Control Xeltek SuperBOT-I Automated Handler
Assistant Control
Built-in Control : PC-based control with Windows XP.
Display : LCD monitor.
Data entry : Keyboard & mouse.
Built-in Programmer
Programming systems are USB Interfaced 4 Ultra-high Speed Stand-alone Universal Device Programming units; SuperPro 5000
Vision System Xeltek SuperBOT-I Automated Handler
Vision System
Camera 400*400 pixels.
Vision resolution 0.1mm.
Process time per view ~0.5sec.
I/O Devices
Tray : It is the standard I/O device of the machine. Users provide the type and three special positions of the tray, and the system can calculate the position of each chip on the tray.
Auto tray : This device includes tray in and tray out. Users can put 10 trays into the device. When the machine is running, users can add trays or take out trays without stopping the machine.
Tape-in Device : An input device for tapes with IC packaging. It must be modified for custom IC size.
Tape-out Device : An output device for tapes with IC packaging. It handles tape widths of 12mm to 40mm. The tape can be air-pressed or heat-sealed.
Tube-In Device
Tube-Out Device
Camera 400*400 pixels.
Vision resolution 0.1mm.
Process time per view ~0.5sec.
I/O Devices
Tray : It is the standard I/O device of the machine. Users provide the type and three special positions of the tray, and the system can calculate the position of each chip on the tray.
Auto tray : This device includes tray in and tray out. Users can put 10 trays into the device. When the machine is running, users can add trays or take out trays without stopping the machine.
Tape-in Device : An input device for tapes with IC packaging. It must be modified for custom IC size.
Tape-out Device : An output device for tapes with IC packaging. It handles tape widths of 12mm to 40mm. The tape can be air-pressed or heat-sealed.
Tube-In Device
Tube-Out Device
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